IMPORTANT DATES (Updated)


  • Final camera-ready paper submission: March 1, 2012
  • Signed copy right form (IET): March 1, 2012
  • Registration fee due: March 8, 2012
  • Information needed for official invitation letter: February 23, 2012
  • Conference begins: May 14, 2012

Introduction

The International Conference on Electrical Contacts (ICEC) is a biannual event hosted by countries in North America, Asia, and Europe on a rotating basis to provide a forum for the presentation and discussion of the latest developments in the field of electrical contacts and the application of recent advances in materials and processes in electric, electronic, and telecommunication equipment. The 26th ICEC will be held jointly with the 4th International Conference on Reliability of Electric Products and Electric Contacts (ICREPEC) on 14 May, 2012 in Beijing, marking the first time ICEC will be held in China.

Attending

Practicing designers, engineers, physicists, and research scientists—both experienced and those new to the field—are invited to attend and participate. The 2012 Joint Conference will include presentations of significant papers on a wide range of subjects authored by some of the most outstanding technical people in this field, with international contributors from universities and industries in Austria, Canada, China, France, Germany, Japan, the Netherlands, Norway, Poland, Switzerland, Russia, Germany, the United Kingdom, the U.S.A., and other countries. Attendees will also have the opportunity to engage this international assembly of experts with questions and discussion topics.

Background

The International Conference on Electrical Contacts was founded in 1961. In recognition of the international scientific activities in the field of electrical contacts, an International Advisory Group from the industrial nations was established. The last three ICECs were held in Sendai, Japan (2006); Saint-Malo, France (2008); and Charleston, SC, USA (2010).

The first International Conference on Reliability of Electric Products and Electric Contacts was held in Suzhou in 2004, the second in Xiamen in 2007, and the third in Wenzhou in 2009. ICREPEC is sponsored by the China Electrotechnical Society (CES) and organized by the Electrical Product Reliability Association of CES.

The 2012 Joint Conference will highlight the most recent developments in the field of electrical contacts worldwide. Research findings and technical areas slated for presentation include contact properties and performance, reliability, environmental effects, arcing, materials, new connector design, relays, circuit breakers, contactors, automotive switches, arcing interrupters, MEM systems, superconductor contacts, and real world design and application; new additions to the technical program include recent advances in arc fault detection and renewable power generation.  

Sponsored by:

  • China Electrotechnical Society CES

Organized by:

  • Electrical Product Reliability Association of CES

Call For Papers


Prospective authors are invited to submit original technical papers in the following areas:

FUNDAMENTALS
  • Thermal effects
  • Conduction & contact resistance
  • Contact Design & surface finishing
  • Sliding & fretting
  • Diffusion
ENVIRONMENTAL EFFECTS
  • Impact & vibration
  • Corrosion
  • Contaminated particles (including dust)
DESIGN/MATERIALS
  • Air and vacuum
  • High frequency relays
  • Ultra miniature relays
  • Carbon fiber
  • Reed relay
  • Switching
  • Surface coating
  • Degradation mechanism
CONNECTORS
  • High frequency
  • High speed data
  • Degradation mechanism
NEW TECHNOLOGY
  • MEMS
  • Micro switches
  • Nano - Technology in connections
  • Nano contacts
  • High DC voltage switching
  • Super conductor connections
  • Arc Fault Safety
RELIABILITY
  • Diagnostics & Testing
  • Degradation mechanism
  • Life prediction
  • Permanent contact - Soldering, welding, crimping
  • Reliability of electrical products
MODELLING & SIMULATION
  • 3DFEA
  • Environmental effects
  • Arc motion
  • Dynamic welding
POWER CONTACTS
  • Crimp terminals
  • Bus bar
  • Lubricants
  • Glowing contacts
SLIDING CONTACTS
  • Slip ring/brush
  • Materials
ARC INTERRUPTION/DESIGN
  • Circuit breakers
  • Vacuum interrupters
  • Contactors
  • Magnetic blowing
  • Hybrid switches
  • Super-conduction limiters
  • Micro-arcing
CONTACTS FOR AUTOMOTIVE & ELECTRIC APPLIANCE
  • Hybrid power
  • Series arc fault
  • Lead-free


SUBMISSION (Updated)

  • The final camera-ready paper submission due date is March 1, 2012

Sponsored Logo:


Location:


The Friendship Hotel of Beijing is one of the largest garden-style hotels in Asia. Located in the heart of the Zhongguancun High-tech Zone, the Friendship Hotel is adjacent to many world-famous tourist sites and universities, such as Tsinghua University, Peking University, and the Summer Palace. The Friendship Hotel was established in 1954 and covers a total area of 200,000 square meters of land in the capital city, of which 60,000 square meters are landscaped in the traditional Chinese garden style. The Friendship Hotel of Beijing represents classic Chinese architectural elegance, while offering a full range of friendly services that cater to your needs for a pleasant stay in Beijing. It is a member of the Beijing 29th Olympic Games official accommodation network.

There are 26 different dining halls on the premises serving continental and Chinese food, and the numerous restaurants can accommodate a total of 3,000 people. Business amenities available within the hotel include translation services, conference facilities, and performance stages. The hotel's multipurpose rooms and variously sized conference halls are furnished with high-tech equipment. There are also excellent sports facilities on the premises, including a gym, sauna, swimming pool, videogame arcade, bowling alley, tennis court, dance hall, karaoke room, etc.

Address: 1 Zhongguancun South St. Beijing, P. R. China
P.C.: 100873
Tel: (86--10)68498888
Fax: (86--10)68498866
E-mail: rd@BJfriendshiphotel.com
Website: http://www.BJfriendshiphotel.com